The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2012

Filed:

Mar. 31, 2008
Applicants:

Sudipta Seal, Orlando, FL (US);

Erik R. Brinley, Orlando, FL (US);

Suresh Babu Krishna Moorthy, Orlando, FL (US);

Abhilash Vincent, Orlando, FL (US);

David Reid, Orlando, FL (US);

Clara Rivero, Orlando, FL (US);

Inventors:

Sudipta Seal, Orlando, FL (US);

Erik R. Brinley, Orlando, FL (US);

Suresh Babu Krishna Moorthy, Orlando, FL (US);

Abhilash Vincent, Orlando, FL (US);

David Reid, Orlando, FL (US);

Clara Rivero, Orlando, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B32B 17/10 (2006.01); B32B 17/06 (2006.01); B05D 3/00 (2006.01); B29C 71/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for depositing sol-gel derived coatings on substrates to form coated substrates includes the steps of providing a first solution including at least one sol precursor and at least one solvent. A water comprising solution is added to the first solution to form a sol-gel. The sol-gel is deposited on a substrate. The sol-gel layer on the substrate is dried/cured at a temperature ≦100° C. for at least 10 minutes to form a solid layer, wherein the solid layer has a thickness from 50 nm to 110 nm. The depositing and curing steps are repeated at least once until combined thickness of the solid layers forms a coating of a predetermined thickness. The resulting solid layers are low water content layers that can be evidenced by transmission measurements. The coated substrate can be an IR transmissive substrate having a recrystallization temperature <130° C. and each of the solid layers provide a transmission at λ=2950 nm, normal incidence and 1 mW power if placed on the IR transmissive substrate of ≧99% of the transmission directly through the IR transmissive substrate.


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