The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2012

Filed:

Mar. 30, 2006
Applicants:

Daniel G. Sanders, Sumner, WA (US);

Larry D. Hefti, Auburn, WA (US);

Gregory L. Ramsey, Seabeck, WA (US);

Inventors:

Daniel G. Sanders, Sumner, WA (US);

Larry D. Hefti, Auburn, WA (US);

Gregory L. Ramsey, Seabeck, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 28/00 (2006.01); B21D 31/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides methods of superplastic forming and diffusion bonding and a gas inlet tube that facilitates the methods which produce structures that are substantially mark off free. Methods include disposing a sealed pack into a die having a patterned surface and an opposite surface; applying a first pressure within the die around an outside of the pack; applying a second pressure within the pack, the second pressure exceeding the first pressure; and forming the pack by superplastic deformation into a diffusion-bonded structure. Further, a gas inlet tube is provided having an inner tube and an outer tube, where the outer tube is weldable to the pack in a gas tight seal.


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