The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Dec. 17, 2010
Min Young Park, Suwon-si, KR;
Young Jun Moon, Hwaseong-si, KR;
Hyun Joo Han, Suwon-si, KR;
Gyun Heo, Seoul, KR;
Kyung Woon Jang, Suwon-si, KR;
Sang IL Hong, Suwon-si, KR;
Dong Seok Baek, Suwon-si, KR;
Min Young Park, Suwon-si, KR;
Young Jun Moon, Hwaseong-si, KR;
Hyun Joo Han, Suwon-si, KR;
Gyun Heo, Seoul, KR;
Kyung Woon Jang, Suwon-si, KR;
Sang il Hong, Suwon-si, KR;
Dong Seok Baek, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.