The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Aug. 02, 2006
Applicants:
Daquan Huang, Santa Monica, CA (US);
Mau-chung Frank Chang, Los Angeles, CA (US);
Inventors:
Daquan Huang, Santa Monica, CA (US);
Mau-Chung Frank Chang, Los Angeles, CA (US);
Assignee:
The Regents of the University of California, Oakland, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
Interleaved three-dimensional (3D) on-chip differential inductorsand transformerare disclosed. The interleaved 3D on-chip differential inductorsand transformermake the best use of multiple metal layers in mainstream standard processes, such as CMOS, BiCMOS and SiGe technologies.
Huang, Daquan. (2012). Interleaved three-dimensional on-chip differential inductors and transformers (U.S. Patent No. 8325001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8325001
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile