The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Sep. 22, 2010
Applicants:
Yukimasa Minami, Chiba, JP;
Masaru Akino, Chiba, JP;
Inventors:
Yukimasa Minami, Chiba, JP;
Masaru Akino, Chiba, JP;
Assignee:
Seiko Instruments Inc., Chiba, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a semiconductor integrated circuit device including fuse elements for carrying out laser trimming processing, in which a space width between aluminum interconnects of the first layer to be connected to the adjacent fuse elements is set to less than twice of the thickness of the side wall of the metal interlayer insulating film of the first layer, thereby preventing exposure of the SOG layer having hygroscopic property. In addition, side spacers are provided to side surfaces of the aluminum interconnects of the first layer.