The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2012

Filed:

Aug. 10, 2010
Applicants:

Takashi Ohtsuka, Tokyo, JP;

Kyung-ku Choi, Tokyo, JP;

Tatsuo Namikawa, Tokyo, JP;

Hitoshi Yamaguchi, Tokyo, JP;

Inventors:

Takashi Ohtsuka, Tokyo, JP;

Kyung-Ku Choi, Tokyo, JP;

Tatsuo Namikawa, Tokyo, JP;

Hitoshi Yamaguchi, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor, which is an electronic component, has: a first upper electrodeformed above a substrate; a first seatand a second seatwhich are formed adjacent to the first upper electrode; passivation layersandthat cover the first upper electrodeand the first and second seatsand; and a terminal electrodeformed above the first and second seatsandand connected to the first upper electrodevia via-conductors Va and Vc which are formed through the passivation layersandrespectively.


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