The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Aug. 25, 2006
Takemori Toshifumi, Chiba, JP;
Yoshiaki Takaya, Chiba, JP;
Takahito Mita, Chiba, JP;
Tetsuya Iizuka, Chiba, JP;
Yuji Hashima, Chiba, JP;
Takahisa Kusuura, Tokyo, JP;
Mitsuru Fujii, Tokyo, JP;
Takuji Taguchi, Tokyo, JP;
Anupam Mitra, Tokyo, JP;
Takemori Toshifumi, Chiba, JP;
Yoshiaki Takaya, Chiba, JP;
Takahito Mita, Chiba, JP;
Tetsuya Iizuka, Chiba, JP;
Yuji Hashima, Chiba, JP;
Takahisa Kusuura, Tokyo, JP;
Mitsuru Fujii, Tokyo, JP;
Takuji Taguchi, Tokyo, JP;
Anupam Mitra, Tokyo, JP;
Scivax Corporation, , JP;
Abstract
A resin for thermal imprint including a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. (° C.)<219×log []−104  [Equation 1]