The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Sep. 17, 2008
Peter Ramm, Pfaffenhofen, DE;
Armin Klumpp, Munich, DE;
Peter Ramm, Pfaffenhofen, DE;
Armin Klumpp, Munich, DE;
Abstract
A method for manufacturing a three-dimensional, electronic system includes: providing a first integrated circuit structure in a first substrate, wherein the first integrated circuit structure has a first contact pad at a first main side of the first substrate; providing a second substrate with a second main side; forming a vertical contact area in the second substrate; after step (c) forming a semiconductor layer on the second main side of the second substrate; forming a semiconductor device of a second integrated circuit structure in the second substrate with the semiconductor layer; removing the substrate material from a side of the second substrate opposite the second main side, so that the vertical contact area at the opposite side is electrically exposed; arranging the first and second substrates on top of each other aligning the vertical contact area with the contact pad, so that an electrical connection between the first and second integrated circuit structures is produced via the vertical contact area and the contact pad.