The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Dec. 04, 2006
Bon Won Koo, Suwon-si, KR;
Joon Yong Park, Yongin-si, KR;
Jung Seok Hahn, Senongnam-si, KR;
Joo Young Kim, Suwon-si, KR;
Kook Min Han, Suwon-si, KR;
Sang Yoon Lee, Seoul, KR;
Bon Won Koo, Suwon-si, KR;
Joon Yong Park, Yongin-si, KR;
Jung Seok Hahn, Senongnam-si, KR;
Joo Young Kim, Suwon-si, KR;
Kook Min Han, Suwon-si, KR;
Sang Yoon Lee, Seoul, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Disclosed is a method for forming banks during the fabrication of electronic devices incorporating an organic semiconductor material that includes preparing an aqueous coating composition having at least a water-soluble polymer, a UV curing agent and a water-soluble fluorine compound. This coating composition is applied to a substrate, exposed using UV radiation and then developed using an aqueous developing composition to form the bank pattern. Because the coating composition can be developed using an aqueous composition rather than an organic solvent or solvent system, the method tends to preserve the integrity of other organic structures present on the substrate. Further, the incorporation of the fluorine compound in the aqueous solution provides a degree of control over the contact angles exhibited on the surface of the bank pattern and thereby can avoid or reduce subsequent surface treatments.