The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
May. 09, 2006
Syuji Anno, Yokkaichi, JP;
Yoshihiro Fujimori, Yokkaichi, JP;
Jouji Akiyama, Yokkaichi, JP;
Katsuji Tanaka, Yokkaichi, JP;
Tetsuya Sugita, Yokohama, JP;
Syuji Anno, Yokkaichi, JP;
Yoshihiro Fujimori, Yokkaichi, JP;
Jouji Akiyama, Yokkaichi, JP;
Katsuji Tanaka, Yokkaichi, JP;
Tetsuya Sugita, Yokohama, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
Provided in this invention are polyethylene terephthalate resins which can suppress the formation of acetaldehyde as a by-product in melt molding of the resins and can provide the molded products reduced in acetaldehyde content. A polyethylene terephthalate resin which has an intrinsic viscosity [η] of not less than 0.70 dl/g and not more than 1.50 dl/g and an acetaldehyde content [AA(ppm by weight)] of not more than 10 ppm by weight, and has such properties that the acetaldehyde content [AA(ppm by weight)] of the molded product obtained by injection molding the resin at 280° C. with its moisture content adjusted to 30±20 ppm by weight and the acetaldehyde content [AA(ppm by weight)] of the molded product obtained by injection molding the resin at 280° C. with its moisture content adjusted to 120±20 ppm by weight satisfy the following formula (1):[()/]×100≧30  (1).