The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2012

Filed:

Aug. 31, 2011
Applicants:

Kenzi Takahasi, Osaka, JP;

Yasushige Tomiyoshi, Osaka, JP;

Takaari Uemoto, Osaka, JP;

Hideo Nagai, Osaka, JP;

Mamoru Takeda, Kyoto, JP;

Yoshio Manabe, Osaka, JP;

Inventors:

Kenzi Takahasi, Osaka, JP;

Yasushige Tomiyoshi, Osaka, JP;

Takaari Uemoto, Osaka, JP;

Hideo Nagai, Osaka, JP;

Mamoru Takeda, Kyoto, JP;

Yoshio Manabe, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S/S≦3.0, is satisfied where Sdenotes an area of a portion of the mount member in contact with the case and Sdenotes an area of the portion of the mount member in contact with a substrate of the LED module.


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