The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Aug. 24, 2011
Takahiro Hayashi, Komaki, JP;
Satoru Watanabe, Minokamo, JP;
Hajime Saiki, Konan, JP;
Koji Sakuma, Komaki, JP;
Takahiro Hayashi, Komaki, JP;
Satoru Watanabe, Minokamo, JP;
Hajime Saiki, Konan, JP;
Koji Sakuma, Komaki, JP;
NGK Spark Plug Co., Ltd., Nagoya, JP;
Abstract
A wiring substrate manufacturing method includes: preparing a wiring substrate including a core layer having a principal surface, a resin insulating layer and a conductor layer alternately laminated to form at least one laminated layer on the one principal surface of the core layer, a solder resist layer including opening portions and formed on an outermost surface of the at least one laminated layer such that respective portions of an outermost conductor layer are exposed from the opening portions; forming a Sn-containing underlying layer on the respective portions of the outermost conductor layer by a plating process; and fusing the Sn-containing underlying layer to the respective portions of the outermost conductor layer by a heating process, then mounting solder balls directly on respective portions of the Sn-containing underlying layer, and then connecting the solder balls to the respective portions of the Sn-containing underlying layers.