The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Nov. 26, 2008
Toshiyuki Fuyutsume, Kyoto, JP;
Taro Nishino, Kyoto, JP;
Hisashi Yamazaki, Kyoto, JP;
Kiyoto Araki, Kyoto, JP;
Noboru Tamura, Yamanashi, JP;
Nakaba Ichikawa, Yamanashi, JP;
Masaki Aruga, Yamanashi, JP;
Toshiyuki Fuyutsume, Kyoto, JP;
Taro Nishino, Kyoto, JP;
Hisashi Yamazaki, Kyoto, JP;
Kiyoto Araki, Kyoto, JP;
Noboru Tamura, Yamanashi, JP;
Nakaba Ichikawa, Yamanashi, JP;
Masaki Aruga, Yamanashi, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Koike Co., Ltd., Yamanshi, JP;
Abstract
Provided are an acoustic wave device and a method for manufacturing the same, the acoustic wave device being effectively prevented from expanding and contracting due to temperature change and having a small frequency shift. The acoustic wave device of the present invention has a piezoelectric substrate () having an IDT () formed on one principal surface of the piezoelectric substrate (), and a thermal spray film () formed on an opposite principal surface () of the piezoelectric substrate (), the thermal spray film being of a material having a smaller linear thermal expansion coefficient than the piezoelectric substrate () and having grain boundaries and pores (), at least a part of which is filled with a filling material ().