The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Sep. 16, 2010
Applicants:
Chang-han Shim, Changwon, KR;
Sung-kwan Paek, Changwon, KR;
Inventors:
Chang-han Shim, Changwon, KR;
Sung-kwan Paek, Changwon, KR;
Assignee:
Samsung Techwin Co., Ltd., Changwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A lead frame having improved connectivity with a molded portion and a method of manufacturing the lead frame are provided. The lead frame includes a die pad on which a semiconductor chip is to be disposed; at least one lead portion arranged to be connected to the semiconductor chip; and at least one plating layer formed on at least one of the at least one lead portion and the die pad, wherein a top surface of the at least one plating layer has an uneven portion having a first average surface roughness.