The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Jul. 08, 2010
Christophe Serre, Saint Cyr sur Loire, FR;
Laurent Barreau, Cinq Mars la Pile, FR;
Vincent Jarry, La Membrolle sur Choisille, FR;
Patrick Hougron, Parcay Meslay, FR;
Christophe Serre, Saint Cyr sur Loire, FR;
Laurent Barreau, Cinq Mars la Pile, FR;
Vincent Jarry, La Membrolle sur Choisille, FR;
Patrick Hougron, Parcay Meslay, FR;
STMicroelectronics (Tours) SAS, Tours, FR;
Abstract
A silicon chip surface mounted via balls attached to its front surface, wherein the front and rear surfaces of the chip are covered with a thermosetting epoxy resin having the following characteristics: the resin contains a proportion ranging from 45 to 60% by weight of a load formed of carbon fiber particles with a maximum size of 20 μm and with its largest portion having a diameter ranging between 2 and 8 μm, on the front surface side, the loaded resin covers from 45 to 60% of the ball height, on the rear surface side, the loaded resin has a thickness ranging between 80 and 150 μm.