The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Feb. 08, 2008
Applicants:
Richard Beanland, Northamptonshire, GB;
Stephen Jones, Northamptonshire, GB;
Ian Juland, Northamptonshire, GB;
Inventors:
Richard Beanland, Northamptonshire, GB;
Stephen Jones, Northamptonshire, GB;
Ian Juland, Northamptonshire, GB;
Assignee:
Oclaro Technology Limited, Northamptonshire, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A metallization on a semiconductor substrate is disclosed in the form of a laminate comprising a plurality of layers of a 'conducting' metallization for providing electrical conductivity, interspersed with a plurality of layers of another metallization. By providing many layers the thickness of each individual layer can be reduced. Reduction in thickness of each layer leads to a reduction in grain size and a consequent reduction in creep over the lifetime of a device.