The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

May. 04, 2009
Applicants:

Robert E. Hefner, Jr., Lake Jackson, TX (US);

John W. Hull, Jr., Midland, MI (US);

James W. Ringer, Midland, MI (US);

John N. Argyropoulos, Midland, MI (US);

Inventors:

Robert E. Hefner, Jr., Lake Jackson, TX (US);

John W. Hull, Jr., Midland, MI (US);

James W. Ringer, Midland, MI (US);

John N. Argyropoulos, Midland, MI (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.


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