The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
May. 30, 2006
Kanae Nakagawa, Kawasaki, JP;
Motoaki Tani, Kawasaki, JP;
Kanae Nakagawa, Kawasaki, JP;
Motoaki Tani, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The resin layer formation method comprises the step of forming on a substratea resin layerfor containing a substance for decreasing the thermal expansion coefficient to thereby forming a resin layerhaving said substance localized in the side thereof nearer to the substrate; and the step of cutting the surface of the resin layerwith a cutting toolto planarize the surface of the resin layer. The resin layeras said substance for decreasing the thermal expansion coefficient localized in the side thereof nearer to the substrate, and the surface of the resin layeris cut to planarize the surface of the resin layer, whereby the extreme abrasion and breakage of the cutting toolby said substance for decreasing the thermal expansion coefficient can be prevented.