The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

Jun. 15, 2010
Applicants:

Hongqing Vincent Wang, Fort Mill, SC (US);

Pavan Kumar, Rock Hill, SC (US);

John Stockwell, Sylmar, CA (US);

Khalil Moussa, Charlotte, NC (US);

Rajeev Kulkami, Charlotte, NC (US);

Inventors:

Hongqing Vincent Wang, Fort Mill, SC (US);

Pavan Kumar, Rock Hill, SC (US);

John Stockwell, Sylmar, CA (US);

Khalil Moussa, Charlotte, NC (US);

Rajeev Kulkami, Charlotte, NC (US);

Assignee:

3D Systems, Inc., Rock Hill, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 35/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are provided method and apparatus for the forming of three-dimensional objects in a layered fashion, wherein improvements are made to the support structure to improve the quality of the resulting three-dimensional objects. The support structure may include encapsulation along the interface boundary of the support-object interface to prevent or reduce the likelihood of separation of the build material, that forms the three-dimensional object, from the support material, that forms the support structure, or vice versa. The support structure may also or alternatively include both a porous support structure and a solid support structure to prevent or reduce the likelihood of separation of the support structure from the build platform and to improve the quality of the down-facing surfaces of the three-dimensional object. Methods are also provided for selectively depositing the support material and build material and for encapsulating the interface boundary with support material.


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