The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Jun. 29, 2009
Michitaka Hattori, Nagoya, JP;
Satoshi Imaeda, Nagoya, JP;
Toshihiko Kariya, Nagoya, JP;
Mitsubishi Heavy Industries Plastic Technology Co., Ltd., Nagoya-shi, Aichi, JP;
Abstract
In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified. In the mold temperature control circuit of the injection molding device, a junction piping is able to commonly use the respective supply pipings of the heating-use medium, the cooling-use medium and the scavenging compressed air to the molds and the respective discharge pipings thereof, and there is provided mold bypass piping coupling the supply-side junction piping of the heating medium with the discharge-side junction piping, a mold bypass on-off valve, a passed heating medium sensor, a mold-temperature adjusting control device which stores a mold temperature determination program and a passed heating medium determination program.