The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Dec. 21, 2007
John B. Szczech, Schaumburg, IL (US);
Daniel R. Gamota, Palatine, IL (US);
Tomasz L. Klosowiak, Glenview, IL (US);
Jerzy Wielgus, Mount Prospect, IL (US);
John B. Szczech, Schaumburg, IL (US);
Daniel R. Gamota, Palatine, IL (US);
Tomasz L. Klosowiak, Glenview, IL (US);
Jerzy Wielgus, Mount Prospect, IL (US);
Motorola Solutions, Inc., Schaumburg, IL (US);
Abstract
A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.