The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

Mar. 23, 2006
Applicants:

Naohiko Era, Hitachi, JP;

Kazuhiko Fukamachi, Hitachi, JP;

Hiroshi Kuwagaki, Hitachi, JP;

Inventors:

Naohiko Era, Hitachi, JP;

Kazuhiko Fukamachi, Hitachi, JP;

Hiroshi Kuwagaki, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01); C22F 1/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5≦Ni/Co≦about 2.


Find Patent Forward Citations

Era, Naohiko. (2012). Copper alloy for electronic materials (U.S. Patent No. 8317948). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8317948

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…