The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Oct. 19, 2010
Shogo Ogaki, Aikoh-gun, JP;
Takashi Ando, Aikoh-gun, JP;
Masaru Inoue, Aikoh-gun, JP;
NHK Spring Co., Ltd., Kanagawa, JP;
Abstract
A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together.