The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8316718 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 27, 2012

Filed:

Aug. 23, 2010
Applicants:

Yizhen Lin, Gilbert, AZ (US);

Woo Tae Park, Singapore, SG;

Mark E. Schlarmann, Chandler, AZ (US);

Hemant D. Desai, Gilbert, AZ (US);

Inventors:

Yizhen Lin, Gilbert, AZ (US);

Woo Tae Park, Singapore, SG;

Mark E. Schlarmann, Chandler, AZ (US);

Hemant D. Desai, Gilbert, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectromechanical systems (MEMS) pressure sensor device () includes a substrate structure () having a cavity () formed therein and a substrate structure () having a reference element () formed therein. A sense element () is interposed between the substrate structures () and is spaced apart from the reference element (). The sense element () is exposed to an external environment () via one of the cavity () and a plurality of openings () formed in the reference element (). The sense element () is movable relative to the reference element () in response to a pressure stimulus () from the environment (). Fabrication methodology () entails forming () the substrate structure () having the cavity (), fabricating () the substrate structure () including the sense element (), coupling () the substrate structures, and subsequently forming () the reference element () in the substrate structure ().


Find Patent Forward Citations

Lin, Yizhen. (2012). Mems pressure sensor device and method of fabricating same (U.S. Patent No. 8316718). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8316718

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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