The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8315728 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 20, 2012

Filed:

Jan. 21, 2009
Applicants:

Yasuhiro Maenishi, Halstenbek, DE;

Yoshiaki Awata, Fukuoka, JP;

Inventors:

Yasuhiro Maenishi, Halstenbek, DE;

Yoshiaki Awata, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01);
U.S. Cl.
CPC ...
Abstract

Provided is a component mounting condition determination method of a component mounter () that can improve a throughput of a whole production line. The method determines a mounting condition of the component mounter () that mounts components on boards, for use in a production line including the component mounter () including transportation lanes aligned parallel to each other. The method includes determining the mounting condition so that a line tact ratio among the transportation lanes approximates a predetermined ratio (Sto S).


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Maenishi, Yasuhiro. (2012). Component mounting condition determination method (U.S. Patent No. 8315728). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8315728

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