The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
Aug. 28, 2008
Yusuke Inoue, Takasaki, JP;
Eiji Mugiya, Takasaki, JP;
Masashi Miyazaki, Takasaki, JP;
Tatsuro Sawatari, Takasaki, JP;
Yuichi Sugiyama, Takasaki, JP;
Yusuke Inoue, Takasaki, JP;
Eiji Mugiya, Takasaki, JP;
Masashi Miyazaki, Takasaki, JP;
Tatsuro Sawatari, Takasaki, JP;
Yuichi Sugiyama, Takasaki, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
In a multi-layer substrate including a core formed with a plurality of holes capable of containing an electronic part, a bottom insulating resin layer formed on a bottom surface of the core, a top insulating resin layer formed on a top surface of the core, a wiring layer selectively formed on an outer layer of the bottom insulating resin layer or top insulating resin layer, and an electronic part contained in the holes, both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain insulation between the electronic part or a conductor of the core and the wiring layer and which inherently undergoes small plastic deformation, so that the electronic part can be securely and sealed in the holes without using a particular adhesive.