The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
Jul. 28, 2006
Norikazu Tabata, Otsu, JP;
Kazuhiko Hashisaka, Otsu, JP;
Masahiro Sugimura, Otsu, JP;
Takuo Sakamoto, Koka, JP;
Masaki Ue, Kyoto, JP;
Hiroyuki Nakayama, Otsu, JP;
Seiji Fukuda, Nishinomiya, JP;
Norikazu Tabata, Otsu, JP;
Kazuhiko Hashisaka, Otsu, JP;
Masahiro Sugimura, Otsu, JP;
Takuo Sakamoto, Koka, JP;
Masaki Ue, Kyoto, JP;
Hiroyuki Nakayama, Otsu, JP;
Seiji Fukuda, Nishinomiya, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same.