The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2012

Filed:

Aug. 26, 2010
Applicants:

Tomoya Satonaka, Kanagawa-ken, JP;

Katsunori Yahashi, Mie-ken, JP;

Inventors:

Tomoya Satonaka, Kanagawa-ken, JP;

Katsunori Yahashi, Mie-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method can include forming a stacked body by alternately stacking a plurality of insulating layers and a plurality of conductive layers above a substrate and forming a resist film above the stacked body. The method can include plasma-etching the insulating layers and the conductive layers by using the resist film as a mask. The method can include forming a hardened layer in an upper surface of the resist film by plasma treatment using a gas containing at least one selected from a group consisting of boron, phosphorus, arsenic, antimony, silicon, germanium, aluminum, gallium, and indium. The method can include slimming a plane size of the resist film by plasma treatment using an oxygen-containing gas in a state where the hardened layer is formed in the upper surface of the resist film.


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