The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
May. 16, 2011
Ryoichi Kajiwara, Hitachi, JP;
Shigehisa Motowaki, Mito, JP;
Kazutoshi Itou, Hitachi, JP;
Hiroshi Hozoji, Hitachiota, JP;
Ryoichi Kajiwara, Hitachi, JP;
Shigehisa Motowaki, Mito, JP;
Kazutoshi Itou, Hitachi, JP;
Hiroshi Hozoji, Hitachiota, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A fabrication method for a resin encapsulated semiconductor device includes the steps of: (1) die-bonding a semiconductor device to a first electrical connection metallic terminal of a wiring substrate; (2) electrically connecting an electrode of the semiconductor device and a second electrical connection metallic terminal of the wiring substrate via an electrical connector; (3) surface treating such an assembly by applying a solution to a surface of the assembly and baking the applied solution; and (4) transfer-molding an insulating encapsulating resin onto the surface-treated assembly.