The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
Feb. 02, 2010
Takaaki Mitsuoka, Utsunomiya, JP;
Akihiro Nonogaki, Sakura, JP;
Tetsuhiro Takehara, Utsunomiya, JP;
Masaru Oda, Utsunomiya, JP;
Seiji Sugiura, Utsunomiya, JP;
Teruyuki Ohtani, Tochigi-ken, JP;
Keisuke Ando, Saitama, JP;
Takaaki Mitsuoka, Utsunomiya, JP;
Akihiro Nonogaki, Sakura, JP;
Tetsuhiro Takehara, Utsunomiya, JP;
Masaru Oda, Utsunomiya, JP;
Seiji Sugiura, Utsunomiya, JP;
Teruyuki Ohtani, Tochigi-ken, JP;
Keisuke Ando, Saitama, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A first separator to which a resin film is joined beforehand is set in a cavity formed between a lower die and an upper die of an injection molding machine. At the time of die locking by moving the upper die toward the lower die, in the case where the total thickness of the resin film and the first separator is larger than a predetermined dimension, the resin film is pressed by the lower die or the upper die, and thus, the resin film is deformed by compression within its elastic deformation range.