The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2012

Filed:

Feb. 19, 2009
Applicants:

Ian Bentley, New Ipswich, NH (US);

Jim Cook, Freeport, IL (US);

Lamar Floyd Ricks, Lewis Center, OH (US);

Alistair David Bradley, Dublin, OH (US);

Richard Wade, Worthington, OH (US);

Inventors:

Ian Bentley, New Ipswich, NH (US);

Jim Cook, Freeport, IL (US);

Lamar Floyd Ricks, Lewis Center, OH (US);

Alistair David Bradley, Dublin, OH (US);

Richard Wade, Worthington, OH (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.


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