The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2012

Filed:

Jan. 18, 2006
Applicants:

Richard James Casler, Jr., Cupertino, CA (US);

Fenglei Du, Fremont, CA (US);

Stephen Craig Fullerton, Corvallis, OR (US);

Inventors:

Richard James Casler, Jr., Cupertino, CA (US);

Fenglei Du, Fremont, CA (US);

Stephen Craig Fullerton, Corvallis, OR (US);

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01C 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.


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