The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2012

Filed:

Aug. 27, 2007
Applicants:

Hiroshi Fujii, Toyama, JP;

Takuya Kyouda, Toyama, JP;

Hiroki Takeoka, Osaka, JP;

Inventors:

Hiroshi Fujii, Toyama, JP;

Takuya Kyouda, Toyama, JP;

Hiroki Takeoka, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 2/00 (2006.01); H01G 4/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A metallization film capacitor that achieves both high heat resistance and high withstand voltage at the same time. A metal-deposited electrode is formed on a PEN film in each of a pair of metalized films. These metalized films are wound such that the metal-deposited electrodes face each other via the dielectric film in between. A metalized contact electrode is formed on both end faces of these wound metalized films to configure the metallization film capacitor. A divisional electrode is provided on the metal-deposited electrode. In addition, a fuse is coupled to this divisional electrode for providing a self-maintaining function. Pass rate a/b of a deposition pattern is set to 4.0 or smaller, where 'a' is the fuse width, and 'b' is the length of the divisional electrode in a lengthwise direction of the metalized films.


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