The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Aug. 12, 2008
Kou Sasaki, Kanagawa, JP;
Kou Sasaki, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-Shi, Kanagawa, JP;
Abstract
A semiconductor apparatus capable of detecting a crack generated in a semiconductor chip while the design freedom, the layout freedom of a wiring, the layout efficiency of LSI, and the layout efficiency of a package substrate are improved. The semiconductor apparatus according to the invention includes a semiconductor chip having a multilayered wiring structure; plural electrode pads being formed on a top surface along the outer periphery of the semiconductor chip; and a wiring being coupled to a first electrode pad and a second electrode pad selected from the plural electrode pads and formed along the entire outer periphery of the semiconductor chip in plan view. The wiring includes a first wiring and a second wiring that are formed on different layers, and the first wiring and the second wiring are connected in series by a connection plug.