The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Oct. 08, 2010
Yoshitsugu Kawashima, Kanagawa, JP;
Yoshitsugu Kawashima, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
In a wafer, a first chip region and a second chip region are separated from each other by a dicing region. The dicing region includes: a first center region; a first intermediate region located on the first chip region's side of the first center region; a second intermediate region located on the second chip region's side of the first center region; a first outer region located on the first chip region's side of the first intermediate region; and a second outer region located on the second chip region's side of the second intermediate region. Surfaces of the first and second intermediate regions are respectively covered by bank-shaped resin films extending in a longitudinal direction of the dicing region. Respective surfaces of the first center region, the first outer region and the second outer region are not covered by resin films.