The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Sep. 14, 2010
Katsuyoshi Nakayama, Tokyo, JP;
Akihiro Hishinuma, Koriyama, JP;
Rui Yanagawa, Koriyama, JP;
Kazuyoshi Orihara, Tokyo, JP;
Yasuko Osaki, Tokyo, JP;
Kenji Imakita, Tokyo, JP;
Takashi Ootsuki, Tokyo, JP;
Hideaki Hayashi, Tokyo, JP;
Shinji Honda, Koriyama, JP;
Katsuyoshi Nakayama, Tokyo, JP;
Akihiro Hishinuma, Koriyama, JP;
Rui Yanagawa, Koriyama, JP;
Kazuyoshi Orihara, Tokyo, JP;
Yasuko Osaki, Tokyo, JP;
Kenji Imakita, Tokyo, JP;
Takashi Ootsuki, Tokyo, JP;
Hideaki Hayashi, Tokyo, JP;
Shinji Honda, Koriyama, JP;
Asahi Glass Company, Limited, Tokyo, JP;
Abstract
To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO, from 13 to 18% of BO, from 9 to 23% of CaO, from 3 to 8% of AlOand from 0.5 to 6% of at least one of KO and NaO in total, and a ceramic filler.