The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Sep. 14, 2010
Yong Ha Hwang, Uiwang-si, KR;
Jae Hyun Cho, Uiwang-si, KR;
Gyu Seok Song, Uiwang-si, KR;
Chang Beom Chung, Uiwang-si, KR;
Yong Ha Hwang, Uiwang-si, KR;
Jae Hyun Cho, Uiwang-si, KR;
Gyu Seok Song, Uiwang-si, KR;
Chang Beom Chung, Uiwang-si, KR;
Cheil Industries, Inc., Gumi-si, Gyeongsangbuk-do, KR;
Abstract
A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer.