The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Sep. 30, 2010
Yuan Xu, Santa Clara, CA (US);
Wei HU, San Mateo, CA (US);
Justin Jia-jen Hwu, Fremont, CA (US);
Gene Gauzner, San Jose, CA (US);
Koichi Wago, Sunnyvale, CA (US);
David Shiao-min Kuo, Palo Alto, CA (US);
Yuan Xu, Santa Clara, CA (US);
Wei Hu, San Mateo, CA (US);
Justin Jia-Jen Hwu, Fremont, CA (US);
Gene Gauzner, San Jose, CA (US);
Koichi Wago, Sunnyvale, CA (US);
David Shiao-Min Kuo, Palo Alto, CA (US);
Seagate Technology LLC, Cupertino, CA (US);
Abstract
A planarization process may planarize a media disk that has data trenches between data features and larger servo trenches between servo features. A filler material layer is deposited on the media disk and provides step coverage of the trenches. The filler material has data recesses over the data trenches and servo recesses over the servo trenches that must be removed to produce a planar media surface. A first planarization process is used to remove the data recesses and a second planarization process is used to remove the servo recesses.