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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8308350 B1

PDFFull Text
Expired
Date of Patent:
Nov. 13, 2012

Filed:

Aug. 09, 2005

Method of determining thermal property of substrate and method of deciding heat treatment condition

Applicants:

Yoichiro Yasuda, Tokyo, JP;

Toshiyuki Tsukamoto, Tokyo, JP;

Masamori Sanaka, Tokyo, JP;

Hiroshi Asechi, Tokyo, JP;

Atsuhiro Ogura, Tokyo, JP;

Inventors:

Yoichiro Yasuda, Tokyo, JP;

Toshiyuki Tsukamoto, Tokyo, JP;

Masamori Sanaka, Tokyo, JP;

Hiroshi Asechi, Tokyo, JP;

Atsuhiro Ogura, Tokyo, JP;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorneys:

Moser Taboada

Alan Taboada

Primary Examiner:

Lisa Caputo

Assistant Examiner:

Mirellys Jagan

Int. Cl.
CPC ...
G01N 25/20 (2006.01); G01K 3/00 (2006.01); G01K 13/00 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

[Problem] To provide a method that can determine a thermal property of a substrate in a short time and a method that can determine a thermal process condition of an open-loop step. [Solving Means] In accordance with the substrate thermal property determining method of the present invention in a rapid thermal processing apparatuscomprising lampsfor heating a wafer W and temperature sensors Tto Tarranged so as to oppose the lamps, temperature data sequentially outputted from the temperature sensors Tto Tis obtained, while subjecting the wafer W arranged between the lampsand temperature sensors Tto Tto pulsed heating with the lamps. Thereafter, the thermal property of the wafer W is determined by using the temperature data.

Find Patent Forward Citations

Yasuda, Yoichiro. (2012). Method of determining thermal property of substrate and method of deciding heat treatment condition (U.S. Patent No. 8308350). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8308350

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