The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2012

Filed:

Apr. 14, 2010
Applicants:

David K. Mcelfresh, San Diego, CA (US);

Anton A. Bougaev, La Jolla, CA (US);

Aleksey Urmanov, La Jolla, CA (US);

Inventors:

David K. McElfresh, San Diego, CA (US);

Anton A. Bougaev, La Jolla, CA (US);

Aleksey Urmanov, La Jolla, CA (US);

Assignee:

Oracle International Corporation, Redwood City, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and system for identifying voids in solder balls in a ball-grid array (BGA) using an image of the BGA include localizing an image of a solder ball on the BGA image, the solder ball image having a radius and having multiple points each having an image intensity, and producing a void-free model image of the solder ball based on the radius of the solder ball image, the void-free model image having multiple points each having an image intensity. The method and system also include computing a difference between the image intensities of the points of the solder ball image and the image intensities of the points of the void-free model image to produce a residual image, and identifying a void using the residual image.


Find Patent Forward Citations

Loading…