The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Jul. 23, 2009
Kentaro Mori, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Masaya Kawano, Kanagawa, JP;
Koji Soejima, Kanagawa, JP;
Kentaro Mori, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Masaya Kawano, Kanagawa, JP;
Koji Soejima, Kanagawa, JP;
NEC Corporation, Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device includes a plural number of interconnects and a plural number of vias are stacked. A semiconductor element is enclosed in an insulation layer. At least one of the vias provided in insulation layers and/or at least one of interconnects provided in the interconnect layers are of cross-sectional shapes different from those of the vias formed in another one of the insulation layers and/or interconnects provided in another one of the interconnect layers.