The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Jul. 27, 2011
Satoshi Matsui, Kanagawa, JP;
Tsuyoshi Eda, Kanagawa, JP;
Akira Matsumoto, Kanagawa, JP;
Yoshitaka Kyougoku, Kanagawa, JP;
Shinji Watanabe, Kanagawa, JP;
Hirokazu Honda, Kanagawa, JP;
Satoshi Matsui, Kanagawa, JP;
Tsuyoshi Eda, Kanagawa, JP;
Akira Matsumoto, Kanagawa, JP;
Yoshitaka Kyougoku, Kanagawa, JP;
Shinji Watanabe, Kanagawa, JP;
Hirokazu Honda, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device includes a semiconductor chip, wiring formed thereon, a first insulating film formed on the wiring, provided with a first opening, a pad electrode formed so as to be in contact with the wiring, a second insulating film formed on the pad electrode film, provided with a second opening, and a flip chip bump formed so as to be in contact with the pad electrode film. In this case, the second insulating film exists between the flip chip bump and the pad electrode film, in a region directly underneath the outer edge of the flip chip bump, as seen in a plan view, and the outer edge of the flip chip bump is formed in a region inside the outer edge of the pad electrode film.