The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2012

Filed:

Jul. 14, 2008
Applicants:

Mika Okumura, Tokyo, JP;

Makio Horikawa, Tokyo, JP;

Kimitoshi Satou, Tokyo, JP;

Yasuo Yamaguchi, Tokyo, JP;

Inventors:

Mika Okumura, Tokyo, JP;

Makio Horikawa, Tokyo, JP;

Kimitoshi Satou, Tokyo, JP;

Yasuo Yamaguchi, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

A recessed portion is provided in first and second insulating films, the first insulating film being stacked on a semiconductor wafer, the second insulating film being stacked on the first insulating film. The first and second insulating films are processed to form wiring in a formation region of the semiconductor wafer in which an acceleration sensor is to be formed. After a sacrificial film is stacked on the wiring and processed, a conductive film is stacked on the wiring and processed to form a plurality of thin film structures in the formation region. The recessed portion surrounds the formation region.


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