The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2012

Filed:

Mar. 26, 2010
Applicants:

Kazuhiro Oyama, Takahagi, JP;

Mutsuhiro Mori, Mito, JP;

Katsuaki Saito, Iwaki, JP;

Yoshihiko Koike, Hitachinaka, JP;

Inventors:

Kazuhiro Oyama, Takahagi, JP;

Mutsuhiro Mori, Mito, JP;

Katsuaki Saito, Iwaki, JP;

Yoshihiko Koike, Hitachinaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
Abstract

An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress can escape. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board serving as a current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and cracks of the cover plate.


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