The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Aug. 12, 2009
Hak-kyoon Byun, Asan-si, KR;
Taehoon Kim, Cheonan-si, KR;
Jongkook Kim, Hwaseong-si, KR;
Sang-uk Han, Hwaseong-si, KR;
Jung-do Lee, Uiwang-si, KR;
Seonhyang You, Daejeon, KR;
Hak-Kyoon Byun, Asan-si, KR;
Taehoon Kim, Cheonan-si, KR;
Jongkook Kim, Hwaseong-si, KR;
Sang-Uk Han, Hwaseong-si, KR;
Jung-Do Lee, Uiwang-si, KR;
Seonhyang You, Daejeon, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Provided is a semiconductor package and a method for fabricating the semiconductor package. The semiconductor package may include a first package having a first semiconductor chip mounted on a first substrate and a second package having a second semiconductor chip mounted on a second substrate, the second substrate being bent to cover a side of the first package to contact the first substrate such that the first and second packages are connected electrically.