The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Apr. 05, 2011
Frank Yu, Taipei Hsien, TW;
Lance Wright, Allen, TX (US);
Chien-te Feng, Taipei Hsien, TW;
Sandra Horton, Farmers Branch, TX (US);
Frank Yu, Taipei Hsien, TW;
Lance Wright, Allen, TX (US);
Chien-Te Feng, Taipei Hsien, TW;
Sandra Horton, Farmers Branch, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A packaged semiconductor device includes a semiconductor die including a substrate having a topside including active circuitry and a bottomside with at least one backside metal layer directly attached. A package including a molding material having a die pad and a plurality of leads is encapsulated within the molding material, wherein the leads include an exposed portion that includes a bonding portion. The topside of the semiconductor die is attached to the die pad, and the package includes a gap that exposes the backside metal layer along a bottom surface of the package. Bond wires couple pads on the topside of the semiconductor die to the leads. The bonding portions, the molding material along the bottom surface of the package, and the backside metal layer are all substantially planar to one another.