The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Apr. 07, 2009
Hiromichi Takaoka, Kanagawa, JP;
Yoshitaka Kubota, Kanagawa, JP;
Hiroshi Tsuda, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-Shi, Kanagawa, JP;
Abstract
A semiconductor device () includes: an electrical fuse () including: a lower layer interconnect () formed on a substrate; a via () provided on the lower layer interconnect () so as to be connected to the lower layer interconnect (); and an upper layer interconnect () provided on the via () so as to be connected to the via (), the electrical fuse being cut, in a state after being cut, through formation of a flowing-out portion, the flowing-out portion being formed when an electrical conductor forming the upper layer interconnect () flows outside the upper layer interconnect (); and a guard upper layer interconnect () (conductive heat-absorbing member) formed in at least the same layer as the upper layer interconnect (), for absorbing heat generated in the upper layer interconnect ().