The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Jun. 01, 2007
Akiyoshi Saitou, Kawasaki, JP;
Takeshi Midorikawa, Kawasaki, JP;
Toru Kuraishi, Kawasaki, JP;
Chikayuki Kumagai, Kawasaki, JP;
Masashi Fujimoto, Kawasaki, JP;
Kenichiro Abe, Kawasaki, JP;
Akiyoshi Saitou, Kawasaki, JP;
Takeshi Midorikawa, Kawasaki, JP;
Toru Kuraishi, Kawasaki, JP;
Chikayuki Kumagai, Kawasaki, JP;
Masashi Fujimoto, Kawasaki, JP;
Kenichiro Abe, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.