The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Jan. 03, 2011
Takeshi Matsumura, Ibaraki, JP;
Masaki Mizutani, Ibaraki, JP;
Sadahito Misumi, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer () on a substrate material () and a die-bonding adhesive layer () on the pressure-sensitive adhesive layer (), wherein the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer (), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region () corresponding to a work attachment region () and a region () corresponding to a part or the whole of the other region (), in the die-bonding adhesive layer (), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer ()<adhesion of the pressure-sensitive adhesive layer (), and the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer () is not higher than 2.3 N/25 mm.