The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Aug. 25, 2009
Kenichi Kawabata, Tokyo, JP;
Hiroshige Ohkawa, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Hiroshige Ohkawa, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
Provided is a method of manufacturing a wiring board, in which: a composite adhesive sheetis attached to one of the surfaces of a support substrate, and a double-sided CCLis attached to the other surface. Then, in an integrated state of the above components, a multilayer wiring structure including a conductive layer and a resin insulating layer is formed on a metal layerof the double-sided CCLby a known build-up method. A thermally foamable adhesive layerof the composite adhesive sheetis then heated, thereby thermally decomposing a thermal foaming agent to generate gas, and the support substrateis separated from the remaining bonded body. Thereafter, a carrier foil layerand a copper foil layerof a carrier-foil coated copper foilare mechanically peeled from each other at a boundary between both the layers, thereby obtaining a wiring board